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NTMFS4707N
Power MOSFET
30 V, 17 A, Single N ? Channel,
SOIC ? 8 Flat Lead
Features
? Fast Switching Times
? Low Gate Charge
? Low R DS(on)
? Low Inductance SOIC ? 8 Package
? These are Pb ? Free Devices
Applications
? Notebooks, Graphics Cards
? DC ? DC Converters
? Synchronous Rectification
V (BR)DSS
30 V
http://onsemi.com
R DS(on) Typ
10 m W @ 10 V
13.5 m W @ 4.5 V
N ? Channel
D
I D Max
17 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
± 20
V
V
G
Continuous Drain Current
(Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
10.2
7.4
A
S
Power Dissipation (Note 1)
Continuous Drain Current
(Note 2)
Power Dissipation (Note 2)
t ≤ 10 s
Steady
State
t ≤ 10 s
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
P D
I D
P D
17
2.3
6.25
6.9
4.9
1.0
W
A
W
1
SOIC ? 8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING DIAGRAM &
PIN ASSIGNMENT
D
S D
S 4707N
S AYWZZ
G D
D
Pulsed Drain Current t p ≤ 10 m s
Operating Junction and Storage Temperature
I DM
T J ,
T STG
51
? 55 to
150
A
° C
4707N
A
Y
= Specific Device Code
= Assembly Location
= Year
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(V DD = 25 V, V GS = 10 V, I PK = 7.0 A,
L = 10 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I S
E AS
T L
6.25
245
260
A
mJ
° C
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
Device Package Shipping ?
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol
Junction ? to ? Ambient – Steady State (Note 1) R q JA
Value
55
Unit
° C/W
NTMFS4707NT1G SOIC ? 8 FL 1500 / Tape & Reel
(Pb ? Free)
NTMFS4707NT3G SOIC ? 8 FL 5000 / Tape & Reel
(Pb ? Free)
Junction ? to ? Ambient – t ≤ 10 s (Note 1) R q JA 20
Junction ? to ? Ambient – Steady State (Note 2) R q JA 122.5
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface ? mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 4
1
Publication Order Number:
NTMFS4707N/D
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